DRAM Manufacturing Moves Toward Logic-Grade Process Steps
Summary
ASM says 6F2 DRAM FinFET adoption could triple related ALD layers, while KLA sees logic-like inspection intensity in some DRAM products.
On October 28, 2026, ASM International (ASMIY) and KLA (KLAC) described DRAM makers adopting transistor, deposition, and inspection steps associated with advanced logic. ASM expects FinFET to enter 6F2 DRAM in 2027 with roughly three times as many related atomic layer deposition layers, while KLA said some DRAM products already require inspection intensity similar to leading-edge logic.[1][2]
DRAM is moving logic processes into peripheral circuitry
A DRAM cell stores data, while peripheral circuitry controls reading and writing. ASM said customers are moving FinFET into 6F2 peripheral circuitry earlier than previously expected to improve performance.[1] FinFET is a three-dimensional transistor structure that requires more complex film steps, including high-k metal gate deposition, and can create additional epitaxy opportunities.
That shift changes the equipment content of DRAM expansion. Capacity growth is no longer only about adding wafer starts. The same wafer can require more deposition, inspection, and metrology steps. KLA added that scarce memory bits and higher performance expectations make yield more valuable, which supports more process-control sampling.[2]
More ALD layers and inspection raise equipment value per wafer
ASM provided a specific timing and magnitude. It expects FinFET deployment in 2027 and said the related ALD layer count could be about three times higher. By late 2027, and especially in 2028, some DRAM layers should use more ALD and epitaxy applications that ASM says it has already won.[1] This is a future increase in process content, not evidence that the revenue has already arrived.
KLA's evidence is closer to the present. It said some DRAM products now have process-control intensity similar to leading-edge logic and that new fabs could accelerate this demand.[2] Deposition and inspection therefore point in the same direction: DRAM process complexity is rising, and equipment spending may grow faster than bit output.
What we are seeing as a result is that some innovations previously expected to come with 4F2 are being pulled forward to 6F2. FinFET is a good example. Customers are now introducing FinFET in the CMOS peripheral circuitry at 6F2 to improve performance. This drives additional ALD layers in the high K metal gate stack, as well as creating opportunities in other applications.
The opportunity has different timelines across equipment categories
Equipment vendors that can handle logic-grade transistors, thin films, and yield control may gain more influence in the DRAM process. Deposition vendors are exposed to additional layers, while inspection and metrology vendors are exposed to greater sampling intensity. For memory manufacturers, the result may be higher capital spending per incremental bit and a slower supply response relative to equipment investment.
The boundary matters. KLA referred only to some products, so its observation cannot be extended to every DRAM line. Nova (NVMI) still describes logic as having greater overall process-control intensity and ties further DRAM intensity gains mainly to future nodes.[3] Investors should track 2027 FinFET adoption, late-2027 and 2028 deposition orders, and the DRAM share of inspection and metrology revenue separately.
Companies exposed to the shift
- Onto Innovation (ONTO): The company is shipping logic-node transistor metrology equipment to a major DRAM customer, giving it exposure to peripheral-circuit upgrades, although this does not establish broad customer adoption.[4]
- Applied Materials (AMAT): Its DRAM peripheral transistor and epitaxy tools address the same 6F2 process steps that ASM discussed; the impact depends on customer timing and tool share.[5]
- Nova (NVMI): Memory represents about 30% of its business, providing exposure to greater DRAM metrology demand, while management's view that logic remains more process-control-intensive is an important counterpoint.[3]
Sources
[1] Drillr · ASM International · 2026-10-28 · Q3 2026 earnings call
[2] Drillr · KLA · 2026-10-28 · September-quarter 2026 earnings call
[3] Drillr · Nova · 2026-08-06 · Q2 2026 earnings call
[4] Drillr · Onto Innovation · 2026-08-06 · Q2 2026 earnings call
[5] Drillr · Applied Materials · 2026-08-13 · Fiscal Q3 2026 earnings call
This article highlights potentially overlooked industry changes and companies. It is not a stock recommendation.