688368.SH
晶丰明源
SSE · Technology · Semiconductors · CN
CNY 122.00
−3.82%Leverage
- Debt / equity
- 0.31x
- Net debt / equity
- 0.12x
- Debt / assets
- 0.17x
- Debt / EBITDA
- 11.26x
- Net debt / EBITDA
- 4.37x
Liquidity & coverage
- Current ratio
- 0.99x
- Quick ratio
- 0.70x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- -CNY 28.7M
Cash & dividend
- FCF / debt
- 0.13x
- Cash flow / debt
- 0.15x
- Dividend per share
- CNY 1.40
- Dividend yield
- 1.0%
- Dividend growth 1y
- +180.0%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026