688233.SH
神工股份
SSE · Technology · Semiconductors · CN
CNY 110.85
−2.07%Leverage
- Debt / equity
- 0.00x
- Net debt / equity
- -0.21x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.03x
- Net debt / EBITDA
- -1.84x
Liquidity & coverage
- Current ratio
- 24.99x
- Quick ratio
- 23.19x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 1.1B
Cash & dividend
- FCF / debt
- 5.44x
- Cash flow / debt
- 26.96x
- Dividend per share
- CNY 0.18
- Dividend yield
- 0.2%
- Dividend growth 1y
- +146.7%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026