688126.SH
沪硅产业
SSE · Technology · Semiconductors · CN
CNY 24.73
+0.41%Leverage
- Debt / equity
- 0.26x
- Net debt / equity
- -0.09x
- Debt / assets
- 0.12x
- Debt / EBITDA
- -7.38x
- Net debt / EBITDA
- 2.56x
Liquidity & coverage
- Current ratio
- 1.40x
- Quick ratio
- 1.13x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 3.0B
Cash & dividend
- FCF / debt
- -1.20x
- Cash flow / debt
- -0.13x
- Dividend per share
- —
- Dividend yield
- —
- Dividend growth 1y
- —
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026