600667.SH
太极实业
SSE · Technology · Semiconductors · CN
CNY 20.30
−5.32%Leverage
- Debt / equity
- 0.45x
- Net debt / equity
- -0.37x
- Debt / assets
- 0.11x
- Debt / EBITDA
- 2.45x
- Net debt / EBITDA
- -2.03x
Liquidity & coverage
- Current ratio
- 1.11x
- Quick ratio
- 1.08x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 2.6B
Cash & dividend
- FCF / debt
- 0.13x
- Cash flow / debt
- 0.22x
- Dividend per share
- CNY 0.07
- Dividend yield
- 0.4%
- Dividend growth 1y
- -31.6%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026