600537.SH
*ST亿晶
SSE · Technology · Semiconductors · CN
CNY 2.10
−1.41%Leverage
- Debt / equity
- -2.15x
- Net debt / equity
- -0.40x
- Debt / assets
- 0.08x
- Debt / EBITDA
- -1.68x
- Net debt / EBITDA
- -0.31x
Liquidity & coverage
- Current ratio
- 0.81x
- Quick ratio
- 0.68x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- -CNY 264.2M
Cash & dividend
- FCF / debt
- 0.41x
- Cash flow / debt
- 0.66x
- Dividend per share
- —
- Dividend yield
- —
- Dividend growth 1y
- +53.8%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026