600206.SH
有研新材
SSE · Technology · Semiconductors · CN
CNY 52.52
−3.17%Leverage
- Debt / equity
- 0.17x
- Net debt / equity
- 0.00x
- Debt / assets
- 0.10x
- Debt / EBITDA
- 1.71x
- Net debt / EBITDA
- 0.04x
Liquidity & coverage
- Current ratio
- 2.35x
- Quick ratio
- 1.34x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 3.3B
Cash & dividend
- FCF / debt
- -1.54x
- Cash flow / debt
- -1.30x
- Dividend per share
- CNY 0.14
- Dividend yield
- 0.3%
- Dividend growth 1y
- +27.5%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026