600171.SH
上海贝岭
SSE · Technology · Semiconductors · CN
CNY 22.17
−2.16%Leverage
- Debt / equity
- 0.00x
- Net debt / equity
- -0.23x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.05x
- Net debt / EBITDA
- -3.37x
Liquidity & coverage
- Current ratio
- 4.95x
- Quick ratio
- 3.06x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 2.4B
Cash & dividend
- FCF / debt
- 12.48x
- Cash flow / debt
- 15.24x
- Dividend per share
- CNY 0.12
- Dividend yield
- 0.5%
- Dividend growth 1y
- -29.4%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026