5331.T
NORITAKE CO.,LIMITED
プライム · ガラス･土石製品 · 建設・資材 · JP
JPY 3,505.00
−0.43%Sep 2, 2026, 10:04 UTC
Noritake announced on September 2 that it developed a polishing pad containing diamond abrasive grains for use in manufacturing silicon carbide (SiC) wafers, which can polish the outer periphery of SiC wafers and improve yield, using only water without abrasive.
Source:Aug 19, 2026, 09:00 UTC
Noritake developed a PFAS removal device for semiconductor factories, with sales planned by fiscal year 2026.
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