300323.SZ
BOE HC SemiTek Corp.
SZSE · Technology · C 制造业 · CN
CNY 8.13
+3.44%Leverage
- Debt / equity
- 0.69x
- Net debt / equity
- 0.62x
- Debt / assets
- 0.32x
- Debt / EBITDA
- 11.77x
- Net debt / EBITDA
- 10.55x
Liquidity & coverage
- Current ratio
- 0.99x
- Quick ratio
- 0.59x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- -CNY 40.7M
Cash & dividend
- FCF / debt
- -0.29x
- Cash flow / debt
- -0.07x
- Dividend per share
- —
- Dividend yield
- —
- Dividend growth 1y
- -52.6%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026