002156.SZ
TongFu Microelectronics Co., Ltd.
SZSE · Technology · C 制造业 · CN
CNY 44.93
+5.10%Leverage
- Debt / equity
- 0.80x
- Net debt / equity
- 0.49x
- Debt / assets
- 0.26x
- Debt / EBITDA
- 2.40x
- Net debt / EBITDA
- 1.48x
Liquidity & coverage
- Current ratio
- 0.74x
- Quick ratio
- 0.51x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- -CNY 5.7B
Cash & dividend
- FCF / debt
- -0.08x
- Cash flow / debt
- 0.51x
- Dividend per share
- CNY 0.08
- Dividend yield
- 0.2%
- Dividend growth 1y
- +80.0%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026