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000021.SZ

Shenzhen Kaifa Technology Co., Ltd.

SZSE · Technology · C 制造业 · CN

CNY 28.53
+2.92%
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  • Oct 29, 2026, 08:50 UTC

    Shenzhen SED reported first-nine-month 2026 revenue of CNY 12.902 billion, attributable net profit of CNY 848 million and adjusted net profit of CNY 809 million.

  • Oct 29, 2026, 08:50 UTC

    Shenzhen SED reported third-quarter 2026 revenue of CNY 4.623 billion, attributable net profit of CNY 304 million and adjusted net profit of CNY 305 million.

  • Oct 26, 2026, 11:12 UTC

    Shenzhen SED plans to publicly list for sale its entire 17.034% stake in O-Net Technologies (Group) Ltd., comprising 64.0266 million shares, subject to shareholder approval.

  • Oct 20, 2026, 03:19 UTC

    Shenzhen SED Industry Co., Ltd. established Shenzhen Peidun Semiconductor Packaging and Testing Co., Ltd., an indirectly wholly owned subsidiary, with registered capital of 500 million yuan.

  • Sep 10, 2026, 22:04 UTC

    Shenzhen Kaifa Technology plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton.

  • Sep 9, 2026, 10:45 UTC

    Shenzhen Kaifa Technology's wholly-owned subsidiary Peidun Technology plans to invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity, including building a new plant and an advanced packaging R&D line, with completion targeted for December 2028.

  • Sep 9, 2026, 10:44 UTC

    Shenzhen Kaifa Technology announced that Han Zongyuan resigned as chairman and director due to retirement, and Zhou Gengshen was elected as the new chairman of the tenth board of directors.

  • Aug 3, 2026, 05:04 UTC

    Chinese advanced packaging companies including JCET, Huatian Technology, SDIC, Tongfu Microelectronics, and Shenghe Jingwei are expanding advanced packaging capacity to address global supply shortages.

  • Jul 3, 2026, 03:55 UTC

    Shenzhen Kaifa Technology (000021.SZ) issued a stock price abnormal fluctuation self-inspection announcement on June 30, 2023, clarifying that its HBM technology is still in the R&D stage and warning of multiple operational risks.