Taiwan Semiconductor Manufacturing Co., Ltd. (TSM) Latest Company News

Sep 30, 2026, 23:59 UTC
Arizona Western College signed memoranda of understanding with Asia University, Lunghwa University of Science and Technology, and National Kaohsiung University of Science and Technology to create student and faculty exchange and semiconductor, engineering and AI training opportunities.
Source:
- kawc.org
Sep 29, 2026, 15:58 UTC
Taiwan's Financial Supervisory Commission and National Development Council, with the Taiwan Stock Exchange and partners, extended the application deadline for the TiBOOST innovation program from September 29 to October 5, 2026, and unveiled the 10-member final judging panel.
Source:
- money.udn.com
Sep 29, 2026, 13:45 UTC
The Philadelphia Semiconductor Index rose 203.46 points, or 1.63%, to 12,668.70 in intraday trading on September 29, 2026, led by Applied Materials, KLA, Onto Innovation, Marvell Technology and Teradyne.
Source:
- news.cnyes.com
Sep 29, 2026, 09:23 UTC
Fubon Asset Management held a press conference in Taiwan on 29 September 2026 marking the 20th anniversary of the listing of its Fubon Technology ETF (0052).
Source:
- tw.stock.yahoo.com
Sep 29, 2026, 07:01 UTC
TSMC presented company and semiconductor industry updates at its Open Innovation Partners North America Technology Symposium.
Source:
- semiengineering.com
Sep 29, 2026, 03:31 UTC
GlobalFoundries is preparing a major global capacity expansion in gallium nitride (GaN) foundry services.
Source:
- digitimes.com
Sep 29, 2026, 03:23 UTC
SK Hynix validated its HBM5 memory with TSMC's CoWoS packaging, according to a September 28 post on its corporate newsroom.
Source:
- digitimes.com
Sep 28, 2026, 17:15 UTC
GQG Partners, led by Rajiv Jain, reversed its bearish stance on technology and increased its tech allocation, with Taiwan Semiconductor Manufacturing Co. and Samsung Electronics accounting for 28% of its flagship international equity fund in August 2026, up from 5.4% in July.
Source:
- moneycontrol.com
Sep 28, 2026, 13:43 UTC
US stocks opened lower on Monday, with the Dow Jones Industrial Average falling more than 300 points as rising oil prices and Treasury yields pressured equities.
Source:
Sep 28, 2026, 06:11 UTC
Li Xiang, CEO of Li Auto, published a statement rejecting the "de-XX-ification" zero-sum framing of self-development strategy, citing Apple, Nvidia, Qualcomm, Tesla, TSMC, CATL, LG and Sunwoda as examples of self-development combined with supplier partnerships.
Source:
- aastocks.com
- nbd.com.cn
Sep 28, 2026, 05:27 UTC
Vanguard International Semiconductor Corp., a venture affiliated with Taiwan Semiconductor Manufacturing Co., is considering building a second chipmaking plant in Singapore to meet growing demand.
Source:
- bloomberg.com
Sep 28, 2026, 03:51 UTC
Vanguard International Semiconductor (VIS) held the opening ceremony for its 12-inch wafer fab VSMC in Singapore on 2026-09-28.
Source:
Sep 27, 2026, 23:49 UTC
TSMC, Formosa Petrochemical and ExxonMobil are collaborating on a carbon capture and storage (CCS) project beneath the seabed off Mailiao, Yunlin, Taiwan, with Formosa Petrochemical reportedly preparing to file an exploration application by the end of 2026.
Source:
- ctee.com.tw
Sep 27, 2026, 00:58 UTC
TSMC plans to add five advanced chip packaging plants at the Chiayi Science Park, which would bring its total advanced packaging plants in Chiayi to 10.
Source:
- finance.sina.cn
Sep 26, 2026, 13:36 UTC
Intel launched Panther Lake, its Core Ultra 7 365 processor, the first commercial implementation of backside power delivery and Intel's first gate-all-around transistors, built on the 18A process with Foveros-S advanced packaging.
Source:
- newsletter.semianalysis.com
Sep 26, 2026, 03:57 UTC
Nanya Technology selected the Pingtung Science Park as the site for its first-phase expansion, its largest-ever plant build, with the National Science and Technology Council expected to formally approve the plan at a science park review meeting on October 1.
Source:
Sep 25, 2026, 17:51 UTC
Industry analysts estimate Google's TPU wafer starts will double in 2027 from 2026 levels, with continued annual growth into 2028, boosting its TPU supply chain including Foxconn, Inventec, Compal, MediaTek and TSMC.
Source:
- money.udn.com
Sep 25, 2026, 17:41 UTC
Intel CEO Lip-Bu Tan said Intel will maintain its long-term cooperation with TSMC, with Intel remaining one of TSMC's top ten customers.
Source:
- money.udn.com
Sep 25, 2026, 14:30 UTC
Intel's 14A chip fabrication technology is being evaluated by Amazon, Apple, AMD, Google, Tesla, Microsoft, Nvidia, and Qualcomm, though none has committed to a deal, according to a Piper Sandler research note.
Source:
- thenews.com.pk
Sep 25, 2026, 12:00 UTC
Intel stated that its 14A process technology is expected to be within 5% of the performance of TSMC's A14 node.
Source:
- tomshardware.com
Sep 25, 2026, 08:15 UTC
Samsung Electro-Mechanics and LG Innotek are strengthening capabilities in advanced semiconductor substrates, including technologies related to Intel's EMIB advanced packaging, as an alternative to TSMC's CoWoS.
Source:
- koreaherald.com
Sep 25, 2026, 03:57 UTC
Vanguard International Semiconductor and NXP Semiconductors' Singapore joint venture VSMC will open its 12-inch wafer fab on September 28, 2026, with mass production scheduled for the first quarter of 2027.
Source:
Sep 24, 2026, 14:10 UTC
TSMC introduced an AI Design Kit to enable AI-driven chip design workflows.
Source:
- eetimes.com
Sep 23, 2026, 19:19 UTC
IC-Link by imec expanded its collaboration with TSMC and joined the TSMC Open Innovation Platform Cloud Alliance as its first managed-cloud service supporting a mixed-partner EDA flow for silicon design.
Source:
- semiconductor-digest.com
Sep 23, 2026, 19:01 UTC
Synopsys announced new collaborations with TSMC to accelerate development of next-generation AI, HPC, and advanced semiconductor systems, spanning A14 design enablement, agentic AI workflows, CoWoS multi-die support, and expanded 2nm IP portfolio.
Source:
- prnewswire.com
- semiconductor-digest.com
Sep 22, 2026, 03:58 UTC
Construction formally began on Taiwan's first advanced packaging supply-chain park at Baipu Industrial Park in Kaohsiung, driven by AI and HPC demand, with TSMC anchoring the site and ASE expansion spurring phase-two development.
Source:
- digitimes.com
Sep 21, 2026, 06:24 UTC
TSMC is building an advanced packaging validation hub in Kaohsiung, southern Taiwan, to accelerate qualification of new technologies amid rapid CoWoS capacity expansion.
Source:
- digitimes.com
Sep 10, 2026, 04:14 UTC
Samsung Electro-Mechanics' glass-substrate rollout is slowing because TSMC's reliability evaluation of its through-glass via (TGV) modules is taking longer than expected, delaying related equipment orders.
Source:
- digitimes.com
Aug 24, 2026, 18:49 UTC
Taiwan Semiconductor Manufacturing (TSM) shares fell approximately 2.3% to $409.41 on Monday morning as the chip selloff spread.
Source:
- gurufocus.com
Aug 21, 2026, 00:39 UTC
U.S. chip stocks rose: Philadelphia Semiconductor Index up 0.53%, SK Hynix up over 4%, Seagate and SanDisk up over 2%, Western Digital up over 1%, Marvell up over 5%, Micron up nearly 4%, Lam Research up over 1%, TSMC up nearly 1%.
Source:
- finance.ifeng.com
Aug 18, 2026, 11:10 UTC
On August 18, 2026, emerging market stock and currency indices fell, ending a four-day winning streak, as global bond selling and rising oil prices weighed on risk sentiment.
Source:
- aastocks.com

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TSM

Arizona Western College signed memoranda of understanding with Asia University, Lunghwa University of Science and Technology, and National Kaohsiung University of Science and Technology to create student and faculty exchange and semiconductor, engineering and AI training opportunities.

Taiwan's Financial Supervisory Commission and National Development Council, with the Taiwan Stock Exchange and partners, extended the application deadline for the TiBOOST innovation program from September 29 to October 5, 2026, and unveiled the 10-member final judging panel.

The Philadelphia Semiconductor Index rose 203.46 points, or 1.63%, to 12,668.70 in intraday trading on September 29, 2026, led by Applied Materials, KLA, Onto Innovation, Marvell Technology and Teradyne.

Fubon Asset Management held a press conference in Taiwan on 29 September 2026 marking the 20th anniversary of the listing of its Fubon Technology ETF (0052).

TSMC presented company and semiconductor industry updates at its Open Innovation Partners North America Technology Symposium.

GlobalFoundries is preparing a major global capacity expansion in gallium nitride (GaN) foundry services.

SK Hynix validated its HBM5 memory with TSMC's CoWoS packaging, according to a September 28 post on its corporate newsroom.

GQG Partners, led by Rajiv Jain, reversed its bearish stance on technology and increased its tech allocation, with Taiwan Semiconductor Manufacturing Co. and Samsung Electronics accounting for 28% of its flagship international equity fund in August 2026, up from 5.4% in July.

US stocks opened lower on Monday, with the Dow Jones Industrial Average falling more than 300 points as rising oil prices and Treasury yields pressured equities.

Li Xiang, CEO of Li Auto, published a statement rejecting the "de-XX-ification" zero-sum framing of self-development strategy, citing Apple, Nvidia, Qualcomm, Tesla, TSMC, CATL, LG and Sunwoda as examples of self-development combined with supplier partnerships.

Vanguard International Semiconductor Corp., a venture affiliated with Taiwan Semiconductor Manufacturing Co., is considering building a second chipmaking plant in Singapore to meet growing demand.

Vanguard International Semiconductor (VIS) held the opening ceremony for its 12-inch wafer fab VSMC in Singapore on 2026-09-28.

TSMC, Formosa Petrochemical and ExxonMobil are collaborating on a carbon capture and storage (CCS) project beneath the seabed off Mailiao, Yunlin, Taiwan, with Formosa Petrochemical reportedly preparing to file an exploration application by the end of 2026.

TSMC plans to add five advanced chip packaging plants at the Chiayi Science Park, which would bring its total advanced packaging plants in Chiayi to 10.

Intel launched Panther Lake, its Core Ultra 7 365 processor, the first commercial implementation of backside power delivery and Intel's first gate-all-around transistors, built on the 18A process with Foveros-S advanced packaging.

Nanya Technology selected the Pingtung Science Park as the site for its first-phase expansion, its largest-ever plant build, with the National Science and Technology Council expected to formally approve the plan at a science park review meeting on October 1.

Industry analysts estimate Google's TPU wafer starts will double in 2027 from 2026 levels, with continued annual growth into 2028, boosting its TPU supply chain including Foxconn, Inventec, Compal, MediaTek and TSMC.

Intel CEO Lip-Bu Tan said Intel will maintain its long-term cooperation with TSMC, with Intel remaining one of TSMC's top ten customers.

Intel's 14A chip fabrication technology is being evaluated by Amazon, Apple, AMD, Google, Tesla, Microsoft, Nvidia, and Qualcomm, though none has committed to a deal, according to a Piper Sandler research note.

Intel stated that its 14A process technology is expected to be within 5% of the performance of TSMC's A14 node.

Samsung Electro-Mechanics and LG Innotek are strengthening capabilities in advanced semiconductor substrates, including technologies related to Intel's EMIB advanced packaging, as an alternative to TSMC's CoWoS.

Vanguard International Semiconductor and NXP Semiconductors' Singapore joint venture VSMC will open its 12-inch wafer fab on September 28, 2026, with mass production scheduled for the first quarter of 2027.

TSMC introduced an AI Design Kit to enable AI-driven chip design workflows.

IC-Link by imec expanded its collaboration with TSMC and joined the TSMC Open Innovation Platform Cloud Alliance as its first managed-cloud service supporting a mixed-partner EDA flow for silicon design.

Synopsys announced new collaborations with TSMC to accelerate development of next-generation AI, HPC, and advanced semiconductor systems, spanning A14 design enablement, agentic AI workflows, CoWoS multi-die support, and expanded 2nm IP portfolio.

Construction formally began on Taiwan's first advanced packaging supply-chain park at Baipu Industrial Park in Kaohsiung, driven by AI and HPC demand, with TSMC anchoring the site and ASE expansion spurring phase-two development.

TSMC is building an advanced packaging validation hub in Kaohsiung, southern Taiwan, to accelerate qualification of new technologies amid rapid CoWoS capacity expansion.

Samsung Electro-Mechanics' glass-substrate rollout is slowing because TSMC's reliability evaluation of its through-glass via (TGV) modules is taking longer than expected, delaying related equipment orders.

Taiwan Semiconductor Manufacturing (TSM) shares fell approximately 2.3% to $409.41 on Monday morning as the chip selloff spread.

U.S. chip stocks rose: Philadelphia Semiconductor Index up 0.53%, SK Hynix up over 4%, Seagate and SanDisk up over 2%, Western Digital up over 1%, Marvell up over 5%, Micron up nearly 4%, Lam Research up over 1%, TSMC up nearly 1%.

On August 18, 2026, emerging market stock and currency indices fell, ending a four-day winning streak, as global bond selling and rising oil prices weighed on risk sentiment.