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INTEL CORP

NASDAQ · Technology · Semiconductors · US

$92.03
+2.43%
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  • Sep 22, 2026, 13:20 UTC

    Singapore-based semiconductor startup Nexstrom, incubated by Xora Innovation, is building equipment and processes, including a product called North Star, designed to grow transition-metal dichalcogenides (TMDs) directly on 300mm wafers for commercial chipmaking.

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  • Sep 22, 2026, 11:38 UTC

    SK Hynix is in negotiations with Intel over memory chip fabrication capacity at Intel's New Albany, Ohio campus, weighing a lease of part of the site or a joint venture with additional partners.

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  • Sep 22, 2026, 11:00 UTC

    Cognex announced it will acquire RealSense, adding a 3D robotic perception platform to expand its machine vision business.

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  • Sep 22, 2026, 07:39 UTC

    AUO's stock hit the daily limit-up for a second consecutive trading day, closing at NT$36.65, a 16-year high since 2010.

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  • Sep 22, 2026, 01:09 UTC

    The 2026 Apsara Conference opened in Hangzhou, with Nvidia as its highest-level (peak) partner, while Intel and AMD are diamond and ruby partners respectively.

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  • Sep 22, 2026, 00:58 UTC

    Suzhou Party Secretary Fan Bo met with Intel China Chairman Wang Zhicong in Suzhou on September 21, 2026, ahead of the 2026 Intel Technology Innovation and Industry Ecosystem Conference, with both sides pledging deeper cooperation in AI applications, integrated circuits and green computing.

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  • Sep 21, 2026, 18:25 UTC

    TriplePoint Venture Growth BDC Corp. appointed Ian Schworer as Chief Investment Officer, effective December 31, 2026.

  • Sep 21, 2026, 07:02 UTC

    VMware discontinued its SmartNIC/DPU firewall and hypervisor offerings, walking back from the SmartNIC space, as stated by Broadcom's Umesh Mahajan at VMware Explore.

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  • Sep 20, 2026, 19:15 UTC

    Intel reportedly approached AU Optronics to cooperate on advanced packaging, including Micro LED substrate packaging and CPO with high-density computing chip integration solutions.

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  • Sep 19, 2026, 10:30 UTC

    Intel suspended its bug bounty program that paid up to $100,000 per flaw and launched a new vulnerability disclosure program through Intigriti that offers no rewards.

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  • Sep 18, 2026, 22:00 UTC

    Intel Foundry moved ASML's high numerical aperture (High-NA) EUV lithography into production.

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  • Sep 18, 2026, 13:55 UTC

    Intel and 3D Glass Solutions signed an MOU for a partnership aimed at bringing $3.3 Bn (₹30,550 Cr) in investment and over 1,800 direct jobs to Odisha.

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  • Sep 18, 2026, 09:12 UTC

    India accounts for around 20% of the global chip design and VLSI workforce, with over 85,000 semiconductor skill sets generated in the country in the past four years, according to Intel's senior vice president Iyengar speaking at SEMICON India 2026.

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  • Sep 18, 2026, 06:48 UTC

    TrendForce reports that TSMC's CoWoS-L 2.5D advanced packaging technology is expected to remain the mainstream AI chip packaging solution through 2028 despite competition from Intel's EMIB-T.

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  • Sep 17, 2026, 18:15 UTC

    RayVector Technologies demonstrated its multi-sensor module and wafer-handling technology for AI-based wafer defect detection at SEMICON India 2026 in Dwarka, New Delhi.

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  • Sep 17, 2026, 17:45 UTC

    ASRock has begun shipping six Z990 chipset motherboard models, including Steel Legend, Taichi Creator, Challenger, Taichi White, Challenger WiFi White, and PRO RS WiFi, from Taiwan and Vietnam ahead of the platform's official launch.

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  • Sep 17, 2026, 14:09 UTC

    US stock futures rose on September 17, 2026, with Dow futures up 582 points (1.13%), S&P 500 futures up 1.21% and NASDAQ 100 futures up 1.58%, as technology shares gained and oil prices retreated.

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  • Sep 17, 2026, 12:01 UTC

    Nota AI launched its integrated NVA solution on Intel Arc Pro B70, expanding customer options for visual AI infrastructure.

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  • Sep 17, 2026, 08:48 UTC

    Advantech partnered with Intel, Qualcomm and AMD to expand its WEDA-driven edge AI ecosystem.

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  • Sep 16, 2026, 19:41 UTC

    Intel CEO warned that memory supply will become a major bottleneck for the semiconductor industry and that CPU supply will tighten, with a memory crunch expected in 2027.

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  • Sep 16, 2026, 16:50 UTC

    Delos Data, a startup founded by Intel veterans, raised $100 million from Matrix, Playground, Socratic Partners and others to develop network chips and software connecting AI chips in data centers.

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  • Sep 16, 2026, 05:55 UTC

    SK Hynix is in talks with Intel about a deal that would see SK Hynix manufacture memory chips on U.S. soil, though potential opposition from Seoul could be a major hurdle.

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  • Sep 11, 2026, 07:01 UTC

    Intel Foundry and ASML said high-NA EUV has processed more than 1 million wafers, including select production layers for Panther Lake, with Intel 18A high-NA layers meeting or exceeding comparable patterns made with conventional EUV.

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  • Sep 10, 2026, 15:41 UTC

    ASML expanded its High-NA lithography ties with Samsung and Intel amid building AI demand.

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  • Aug 18, 2026, 17:32 UTC

    TSMC's advanced packaging CoWoS capacity is oversubscribed, and some back-end orders are reportedly spilling over to Intel's Malaysia plant, which will use partial capacity to support common major customers, breaking past ecosystem conventions.

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  • Jul 30, 2026, 23:59 UTC

    Taiwan Semiconductor Manufacturing Co. (TSMC) is developing a new advanced chip-packaging technology, internally called 'EMIB-like', in partnership with Kinsus Interconnect Technology Corp.

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