688256.SH
寒武纪
SSE · Technology · Semiconductors · CN
CNY 969.05
−6.37%Leverage
- Debt / equity
- 0.00x
- Net debt / equity
- -0.11x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.00x
- Net debt / EBITDA
- -0.59x
Liquidity & coverage
- Current ratio
- 6.03x
- Quick ratio
- 4.08x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 11.6B
Cash & dividend
- FCF / debt
- 432.29x
- Cash flow / debt
- 660.47x
- Dividend per share
- CNY 2.23
- Dividend yield
- 0.2%
- Dividend growth 1y
- —
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026