688249.SH
晶合集成
SSE · Technology · Semiconductors · CN
CNY 38.46
−1.69%Leverage
- Debt / equity
- 0.81x
- Net debt / equity
- 0.68x
- Debt / assets
- 0.32x
- Debt / EBITDA
- 3.85x
- Net debt / EBITDA
- 3.22x
Liquidity & coverage
- Current ratio
- 1.61x
- Quick ratio
- 1.30x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 3.2B
Cash & dividend
- FCF / debt
- -0.26x
- Cash flow / debt
- 0.24x
- Dividend per share
- —
- Dividend yield
- —
- Dividend growth 1y
- —
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026