688230.SH
芯导科技
SSE · Technology · Semiconductors · CN
CNY 53.16
−2.46%Leverage
- Debt / equity
- 0.00x
- Net debt / equity
- -0.04x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.00x
- Net debt / EBITDA
- -0.74x
Liquidity & coverage
- Current ratio
- 37.63x
- Quick ratio
- 36.71x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 2.1B
Cash & dividend
- FCF / debt
- 190.38x
- Cash flow / debt
- 190.82x
- Dividend per share
- CNY 0.43
- Dividend yield
- 0.7%
- Dividend growth 1y
- -46.3%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026