603738.SH
泰晶科技
SSE · Technology · Hardware, Equipment & Parts · CN
CNY 35.93
−4.37%Leverage
- Debt / equity
- 0.00x
- Net debt / equity
- -0.07x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.03x
- Net debt / EBITDA
- -0.75x
Liquidity & coverage
- Current ratio
- 3.54x
- Quick ratio
- 2.68x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 804.6M
Cash & dividend
- FCF / debt
- 4.55x
- Cash flow / debt
- 31.99x
- Dividend per share
- CNY 0.04
- Dividend yield
- 0.1%
- Dividend growth 1y
- -48.8%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026