603501.SH
豪威集团
SSE · Technology · Semiconductors · CN
CNY 82.50
−3.87%Leverage
- Debt / equity
- 0.11x
- Net debt / equity
- -0.39x
- Debt / assets
- 0.07x
- Debt / EBITDA
- 0.61x
- Net debt / EBITDA
- -2.20x
Liquidity & coverage
- Current ratio
- 2.27x
- Quick ratio
- 1.59x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 17.5B
Cash & dividend
- FCF / debt
- 0.42x
- Cash flow / debt
- 1.06x
- Dividend per share
- CNY 0.50
- Dividend yield
- 0.6%
- Dividend growth 1y
- -83.9%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026