603160.SH
汇顶科技
SSE · Technology · Semiconductors · CN
CNY 47.29
−3.23%Leverage
- Debt / equity
- 0.01x
- Net debt / equity
- -0.40x
- Debt / assets
- 0.01x
- Debt / EBITDA
- 0.07x
- Net debt / EBITDA
- -3.42x
Liquidity & coverage
- Current ratio
- 5.31x
- Quick ratio
- 4.72x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 5.9B
Cash & dividend
- FCF / debt
- 10.06x
- Cash flow / debt
- 10.98x
- Dividend per share
- CNY 0.54
- Dividend yield
- 1.0%
- Dividend growth 1y
- -27.8%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026