603005.SH
晶方科技
SSE · Technology · Semiconductors · CN
CNY 31.65
−3.36%Leverage
- Debt / equity
- 0.07x
- Net debt / equity
- -0.36x
- Debt / assets
- 0.06x
- Debt / EBITDA
- 0.58x
- Net debt / EBITDA
- -3.03x
Liquidity & coverage
- Current ratio
- 4.96x
- Quick ratio
- 4.76x
- Cash ratio
- —
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- CNY 2.4B
Cash & dividend
- FCF / debt
- -0.02x
- Cash flow / debt
- 1.65x
- Dividend per share
- CNY 0.12
- Dividend yield
- 0.4%
- Dividend growth 1y
- +42.9%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Mar 1, 2026