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600584.SH

长电科技

SSE · Technology · Semiconductors · CN

CNY 73.80
−6.07%
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  • Sep 3, 2026, 11:54 UTC

    JCET Group announced a private placement of A-shares to raise up to 6.5 billion yuan, with controlling shareholder Panshi Runqi subscribing 22.53% of the total.

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  • Sep 2, 2026, 04:34 UTC

    At the 2026 Integrated Circuit Innovation and Development Conference in Wuxi, China, Jiangsu province unveiled new innovation platforms including a high-density optical-and-electric microsystem integration laboratory led by JCET and an intelligent power-IC and module laboratory.

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  • Aug 26, 2026, 10:30 UTC

    China's leading semiconductor packaging and testing companies, including JCET, Tongfu Microelectronics, and Huatian Technology, announced multibillion-dollar capacity expansion investments in the first half of 2026.

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  • Aug 20, 2026, 13:08 UTC

    JCET Group announced it will entrust related party Shenzhen Runzhi Urban Construction Management Co., Ltd. to provide full-cycle construction project agency management services for its controlling subsidiary's infrastructure projects, with a total estimated amount not exceeding 95.43 million yuan (tax inclusive).

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  • Aug 20, 2026, 13:07 UTC

    JCET Group announced its first-half 2026 results: revenue of 19.527 billion yuan, up 4.96% year-on-year; net profit attributable to shareholders of 845 million yuan, up 79.41%; non-GAAP net profit of 808 million yuan, up 84.73%.

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  • Aug 20, 2026, 13:07 UTC

    JCET Group announced a cash dividend of 0.5 yuan per 10 shares (tax included) for the first half of 2026, with no bonus shares and no capital reserve conversion.

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  • Aug 19, 2026, 08:48 UTC

    On August 19, JCET announced a breakthrough in high-aspect-ratio TSV technology development and completed sample trial production with partners, targeting 2.5D/3D advanced packaging applications.

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  • Jul 29, 2026, 11:01 UTC

    China's advanced packaging industry announced nearly 10 projects totaling approximately 400 billion yuan between May and July 2026, including JCET's 7.8 billion yuan base in Shanghai Lingang, Yongshuo Electronics' 10.3 billion yuan base in Yuyao, and Shanghai Zhengzhuo Xincheng Microelectronics' 7.5 billion yuan project in Shanghai, all targeting advanced packaging technologies.

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  • Jul 22, 2026, 06:14 UTC

    Changdian Technology established Changrun Xinwei System (Shanghai) Co., Ltd. in Shanghai with a registered capital of 4 billion yuan, through its wholly-owned subsidiary Changdian Technology Management Co., Ltd.

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  • Jul 10, 2026, 04:43 UTC

    JCET plans to invest about CNY10 billion (US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity.

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  • Jun 25, 2026, 02:51 UTC

    JCET Group plans to invest CNY7.8 billion (US$1.1 billion) in a new advanced packaging and testing plant in Shanghai Lingang to expand AI chip packaging capacity.

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  • Jun 7, 2026, 02:38 UTC

    JCET opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, targeting AI power modules and CPO demand.

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