403870.KQ
HPSP Co., Ltd.
KOE · Technology · Semiconductors · KR
KRW 50,200.00
−0.40%Leverage
- Debt / equity
- 0.01x
- Net debt / equity
- -0.21x
- Debt / assets
- 0.00x
- Debt / EBITDA
- 0.02x
- Net debt / EBITDA
- -0.70x
Liquidity & coverage
- Current ratio
- 3.41x
- Quick ratio
- 2.95x
- Cash ratio
- 2.33x
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- KRW 220.3B
Cash & dividend
- FCF / debt
- 45.46x
- Cash flow / debt
- 46.56x
- Dividend per share
- KRW 600
- Dividend yield
- 1.2%
- Dividend growth 1y
- +0.0%
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Jun 1, 2026