2330.TW
Taiwan Semiconductor Manufacturing Co., Ltd.
Technology · Semiconductors · TW
Jul 21, 2026, 08:11 UTC
Tokyo Star Bank relocated and expanded its Kumamoto branch on July 21, 2026, and plans to increase branch staffing within the year.
Source:Jul 20, 2026, 01:06 UTC
TSMC plans to issue the third tranche of unsecured ordinary corporate bonds for this year, totaling 18.5 billion New Taiwan dollars, with issuance expected in July.
Source:Jul 17, 2026, 11:32 UTC
Do-Fluoride Chemicals Co., Ltd. has been supplying its self-developed G5-grade electronic-grade hydrofluoric acid steadily and in bulk to TSMC, Samsung, Hua Hong, and ChangXin Memory Technologies.
Source:Jul 16, 2026, 06:48 UTC
TSMC raised its 2026 capital expenditure forecast to $60-64 billion from $52-56 billion.
Source:- finance.sina.cn
- finance.sina.cn
- marketbeat.com
- finance.sina.cn
- techmeme.com
- bloomberg.com
- economictimes.indiatimes.com
- zerohedge.com
- benzinga.com
- finance.stockstar.com
- beincrypto.com
- proactiveinvestors.com
- ibtimes.com
- invezz.com
- tw.stock.yahoo.com
- news.cnyes.com
- ec.ltn.com.tw
- finance.stockstar.com
- ctee.com.tw
- finanzen.at
Jul 16, 2026, 05:34 UTC
TSMC reported that its smartphone business revenue decreased by 4% quarter-over-quarter in the second quarter.
Jul 16, 2026, 01:53 UTC
Taiwan Semiconductor Manufacturing Company (TSMC) concept stock Topco Scientific went ex-dividend with a dividend of over NT$13 per share on July 16, 2026, and its stock price quickly filled the gap in early trading.
Source:Jul 13, 2026, 10:30 UTC
Tata Electronics suffered a data breach by ransomware group World Leaks, leaking over 200,000 files including component designs for Apple and Tesla, and documents involving Taiwan Semiconductor Manufacturing Co and Qualcomm.
Jul 13, 2026, 08:09 UTC
Meta will begin producing its custom AI chip, codenamed Iris, in September to power its AI infrastructure and reduce reliance on Nvidia and AMD.
Jul 13, 2026, 01:17 UTC
TSMC has begun mass production of its 2-nanometer process, and Google will be the first to launch a smartphone using the process with its Pixel 11 series in mid-August 2026.
Source:Jul 12, 2026, 13:41 UTC
TSMC will release its Q2 earnings on July 16.
Jul 10, 2026, 01:02 UTC
Taiwan Semiconductor Manufacturing Company (TSMC) announced it will postpone the release of its monthly sales results to July 13.
Jul 9, 2026, 19:49 UTC
TSMC, ASML, and Imec are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional semiconductor materials, aiming for mass production within five years.
Source:Jul 9, 2026, 02:44 UTC
Samsung Electronics has raised wafer foundry prices for new customers by about 15%, targeting high-demand advanced nodes such as 4nm and 5nm, and some automotive 8nm nodes.
Jul 6, 2026, 17:23 UTC
Creative (Global Unichip Corp.) announced its June 2026 consolidated revenue of NT$4.928 billion, a new monthly record, up 5.4% month-over-month and 103.7% year-over-year.
Source:Jul 3, 2026, 21:30 UTC
Ke Jiao signed a technology licensing agreement with Brooks Automation, granting Brooks an exclusive license to its wafer carrier cleaning equipment technology for a fee of US$16 million (approximately NT$5 billion).
Source:Jul 2, 2026, 09:54 UTC
TSMC announced that Gina Proctor, CFO of its subsidiary TSMC Arizona, is leaving due to a role adjustment.
Source:Jul 2, 2026, 03:52 UTC
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies.
Source:Jul 2, 2026, 03:24 UTC
Socionext announced it will develop a high-performance compute chiplet using TSMC's A14 process technology for AI data center SoCs.
Source:Jul 2, 2026, 02:45 UTC
Foreign investors sold Asian equities at a record pace in the first half of 2026, pulling $137.36 billion from shares across seven Asian markets.
Source:Jul 2, 2026, 01:55 UTC
ASIC design house Global Unichip Corp. (Creative) has secured a major order from a cloud service provider (CSP) and reserved 60,000 CoWoS wafers at TSMC for 2027.
Source:Jul 1, 2026, 19:58 UTC
Samsung Electronics reaffirmed mass production of its 1.4nm process in 2029 and unveiled an enhanced SF1.4+ node for 2030.
Source:Jun 30, 2026, 17:46 UTC
HANMI Semiconductor launched the '2.5D TC Bonder 40' for AI system semiconductors, targeting global foundries and OSAT companies.
Source:Jun 30, 2026, 15:02 UTC
Etched has launched its first inference chip, achieving first-silicon success (A0) on TSMC 4nm process.
Source:Jun 30, 2026, 14:00 UTC
AI chip startup Etched raised capital from Jane Street and a TSMC-linked venture capital firm.
Jun 19, 2026, 07:01 UTC
ASML, TSMC, and imec demonstrated a 300mm integration.
Source:Jun 19, 2026, 07:01 UTC
TSMC presented its A16 angstrom-class GAA CMOS platform with Super Power Rail BPD.
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