06809.HK
Montage Technology Co., Ltd.
HKSE · Technology · Semiconductors · CN
HKD 215.00
−6.60%Leverage
- Debt / equity
- 0.01x
- Net debt / equity
- -0.70x
- Debt / assets
- 0.01x
- Debt / EBITDA
- 0.06x
- Net debt / EBITDA
- -6.49x
Liquidity & coverage
- Current ratio
- 13.58x
- Quick ratio
- 12.91x
- Cash ratio
- 12.06x
- Interest coverage
- —
- EBITDA / interest
- —
- Working capital
- HKD 22.1B
Cash & dividend
- FCF / debt
- 13.43x
- Cash flow / debt
- 16.32x
- Dividend per share
- HKD 0.67
- Dividend yield
- 0.3%
- Dividend growth 1y
- —
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Jun 1, 2026