00818.HK
Hi Sun Technology (China) Limited
HKSE · Technology · Software - Infrastructure · HK
HKD 0.26
+0.00%Leverage
- Debt / equity
- 0.02x
- Net debt / equity
- -1.04x
- Debt / assets
- 0.01x
- Debt / EBITDA
- -0.33x
- Net debt / EBITDA
- 21.52x
Liquidity & coverage
- Current ratio
- 1.64x
- Quick ratio
- 1.63x
- Cash ratio
- 1.31x
- Interest coverage
- -122.95x
- EBITDA / interest
- -119.10x
- Working capital
- HKD 4.2B
Cash & dividend
- FCF / debt
- 8.53x
- Cash flow / debt
- 8.72x
- Dividend per share
- —
- Dividend yield
- —
- Dividend growth 1y
- —
Leverage, liquidity, debt coverage and shareholder-distribution metrics · Data as of Jun 1, 2026