Kulicke and Soffa Industries, Inc.
- Open
- 94.19
- Day high
- 95.68
- Day low
- 92.27
- Prev close
- 99.02
- Volume
- 75K
- Mkt cap
- $5.1B
- P/E (TTM)
- 92.8
- EPS (TTM)
- $1.01
- P/B
- 5.9
- P/S
- 6.6
- Yield
- 0.84%
- Per share
- $0.82
- ▼Insiders net selling -$11.3M over the last 3 months (0 open-market buys, 5 sales)
- 🏛Institutions mixed (13F)
Kulicke and Soffa Industries, Inc. (KLIC) is a Technology company listed on NASDAQ. The stock is up 174% over the past year. Over the trailing 3 months, insiders filed 0 open-market buys and 5 sales (SEC Form 4).
Kulicke and Soffa Industries, Inc. (KLIC) financials & analyst ratings
Fundamentals (TTM)
Source: exchange market data + company filings. Figures are trailing-twelve-month or as most recently reported. For informational purposes only — not investment advice.
KLIC earnings date, history & EPS estimates
| Report date | EPS est | EPS actual | Surprise | Revenue | Rev. surprise |
|---|---|---|---|---|---|
| May 7, 2026 | $0.67 | $0.79 | +17.9% | $243M | +6.1% |
| Feb 4, 2026 | $0.33 | $0.44 | +33.3% | $200M | -13.2% |
| Nov 19, 2025 | $0.22 | $0.28 | +26.1% | $178M | +4.5% |
| Aug 6, 2025 | $0.06 | $0.07 | +16.7% | $148M | -12.6% |
| Feb 4, 2025 | $0.28 | $0.37 | +32.1% | $166M | +0.7% |
| May 1, 2024 | $0.24 | $-0.95 | -495.8% | $172M | +1.1% |
| Jan 31, 2024 | $0.26 | $0.30 | +15.4% | $171M | -0.5% |
| Nov 15, 2023 | $0.43 | $0.51 | +18.6% | $202M | +1.1% |
| May 3, 2023 | $0.26 | $0.38 | +46.2% | $173M | -17.1% |
| Feb 1, 2023 | $0.20 | $0.37 | +85.0% | $176M | -0.1% |
| Nov 16, 2022 | $0.98 | $1.19 | +21.4% | $286M | +3.4% |
| Aug 3, 2022 | $1.60 | $2.09 | +30.6% | $372M | +1.6% |
KLIC insider trading activity (SEC Form 4)
| Date | Insider | Type | Shares | Price |
|---|---|---|---|---|
| Jul 8, 2026 | Olson Jon Adirector | Grant | 407 | — |
| Jul 8, 2026 | Yeo Mui Sungdirector | Grant | 407 | — |
| Jul 8, 2026 | Dignam Denisedirector | Grant | 407 | — |
| Jul 8, 2026 | Kong Peter T Mdirector | Grant | 407 | — |
| Jul 8, 2026 | RICHARDSON DAVID JEFFREYdirector | Grant | 407 | — |
| Jul 8, 2026 | Milzcik Gregory Fdirector | Grant | 407 | — |
| Jun 22, 2026 | Wong Lester Aofficer: Interim CEO and CFO | Sell | 60,000 | $121.71 |
| Jun 15, 2026 | WONG NELSON MUNPUNofficer: Senior Vice President | Sell | 15,000 | $113.72 |
| Jun 12, 2026 | Kong Peter T Mdirector | Sell | 1,551 | $110.00 |
| May 21, 2026 | Yeo Mui Sungdirector | Sell | 20,000 | $100.00 |
| May 12, 2026 | Lim Zi Yaoofficer: General Counsel | Sell | 1,500 | $102.98 |
| Apr 9, 2026 | Yeo Mui Sungdirector | Grant | 675 | — |
| Apr 9, 2026 | Milzcik Gregory Fdirector | Grant | 675 | — |
| Apr 9, 2026 | Dignam Denisedirector | Grant | 675 | — |
| Apr 9, 2026 | Kong Peter T Mdirector | Grant | 675 | — |
Source: KLIC SEC Form 4 filings, latest Jul 8, 2026. For informational purposes only — not investment advice.
See the full KLIC insider & 13F page →Kulicke and Soffa Industries, Inc. company profile
Overview
Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) is a global leader in semiconductor assembly equipment manufacturing, founded in 1951 and headquartered in Singapore. The company has been publicly traded since 1958, making it one of the longest-standing technology companies in the semiconductor capital equipment industry. KLIC designs, manufactures, and sells specialized machinery and tools used to assemble semiconductor devices, serving as a critical enabler in the global electronics supply chain. The company operates through two primary segments: Capital Equipment and Aftermarket Products and Services (APS), with a strong presence in Asia-Pacific markets where much of the world's semiconductor assembly takes place.
Business
Kulicke and Soffa operates in the semiconductor capital equipment industry, which provides the specialized machinery necessary to manufacture and assemble semiconductor chips that power everything from smartphones to automobiles. The semiconductor assembly process involves connecting tiny silicon chips to their packaging and creating the electrical connections that allow them to function in electronic devices. The company's core products include ball bonders and wedge bonders, which are machines that create microscopic wire connections between semiconductor chips and their packages. Ball bonding uses a heated capillary tool to form tiny gold or copper wire connections, while wedge bonding creates aluminum wire connections using ultrasonic energy. These processes are essential for creating the electrical pathways that allow semiconductor chips to communicate with the outside world. KLIC also manufactures Thermo-Compression Bonding (TCB) equipment, which represents advanced packaging technology used for high-performance applications like artificial intelligence chips and high-bandwidth memory. TCB systems create direct copper-to-copper connections without flux, enabling higher density and better performance than traditional methods. The company's product portfolio extends to advanced displays through its LUMINEX system for LED placement, die-attach systems for securing chips to substrates, and various consumable products like capillaries and dicing blades. The Aftermarket Products and Services (APS) segment provides ongoing support, maintenance, repairs, and software solutions. Revenue breakdown by segment shows Capital Equipment generating the majority of sales (approximately 80-85%), while APS provides a more stable revenue base representing 15-20% of total revenue. The company has been expanding its advanced packaging solutions, targeting $275-300 million in advanced packaging revenue for fiscal 2025.
Revenue model
Kulicke and Soffa generates revenue primarily through equipment sales to semiconductor manufacturers, with customers including integrated device manufacturers (IDMs), outsourced semiconductor assembly and test providers (OSATs), and electronics manufacturers. The business model centers on selling high-value capital equipment ranging from hundreds of thousands to several million dollars per system, depending on complexity and capabilities. The company's revenue streams include: 1. Capital equipment sales representing the bulk of revenue, with systems sold to enable semiconductor production capacity expansion. 2. Aftermarket Products and Services providing recurring revenue through spare parts, consumables, maintenance contracts, and equipment upgrades. 3. Software solutions and automation systems that enhance manufacturing efficiency. Key factors that increase margins include technological leadership in advanced packaging solutions like TCB, where KLIC commands premium pricing due to limited competition. The company's strong market position in ball bonding and wedge bonding also supports pricing power. Higher utilization rates at customer facilities drive equipment demand, as manufacturers typically add capacity when utilization exceeds 80%. Factors that pressure margins include cyclical semiconductor demand, which creates volatile revenue patterns. Competitive pricing pressure from Asian equipment manufacturers affects standard product lines. Geographic concentration in China (approximately 70% of revenue) creates exposure to regional economic conditions and trade tensions. Raw material costs and supply chain disruptions can compress margins, while customer consolidation may reduce pricing power. The company's decision to discontinue the Electronics Assembly business reflects margin pressures in lower-value segments.
Competitive moat
Kulicke and Soffa's competitive moat stems from its technological leadership and established customer relationships in specialized semiconductor assembly processes. The company holds a dominant position in ball bonding and wedge bonding markets, with decades of accumulated expertise in precision micro-joining technologies. This technical know-how creates significant barriers to entry, as developing competing equipment requires substantial R&D investment and years of process optimization. The company's strongest moat exists in advanced packaging technologies, particularly Thermo-Compression Bonding (TCB), where KLIC has achieved early market leadership with over 100 systems installed globally. The complexity of TCB processes and the critical nature of these systems in high-value applications like AI chips create customer switching costs and support premium pricing. However, the moat faces several challenges. The semiconductor equipment industry is highly competitive, with well-funded Asian competitors increasingly capable of matching technical specifications at lower prices. Customer concentration among a relatively small number of large semiconductor manufacturers limits pricing power. The cyclical nature of semiconductor demand creates periods where customers defer equipment purchases regardless of technical superiority. Additionally, the company's geographic concentration in China creates regulatory and geopolitical risks that could undermine market access. While KLIC's aftermarket business provides some defensive characteristics through recurring revenue, the overall moat is moderate rather than exceptional, requiring continuous innovation and market expansion to maintain competitive advantages.
Risks & safety
The company demonstrates solid financial stability with manageable risk factors: **Overall Assessment**: Moderate margin of safety with strong liquidity but cyclical earnings volatility. **Cash and Debt Position**: - Cash and short-term investments: $286.5 million (Q2 2025) - Very low debt levels with debt-to-equity ratio of 0.04 - Strong current ratio of 5.18 indicating excellent liquidity - Positive free cash flow generation despite recent losses **Valuation Metrics**: - Trading at negative P/E due to recent restructuring charges - Price-to-book ratio of 2.04 appears reasonable for technology company - Graham net-net value of 9.54 suggests potential undervaluation - EV/EBITDA distorted by negative EBITDA from one-time charges **Other Considerations**: - Cyclical business model creates earnings volatility - Recent restructuring and EA business discontinuation improving focus - Strong balance sheet provides cushion during industry downturns - Geographic concentration in China creates regulatory risks
Recent development
Over the past few years, Kulicke and Soffa has undergone significant strategic transformation focused on advanced packaging technologies and operational efficiency. The company made a pivotal decision in Q2 2025 to discontinue its Electronics Assembly (EA) equipment business, taking $86.6 million in restructuring charges to refocus on core competencies in ball bonding, wedge bonding, thermo-compression bonding, and advanced dispense technologies. The most significant development has been the expansion of Thermo-Compression Bonding (TCB) capabilities, growing from a nascent technology to over 100 installed systems globally with approaching $200 million in cumulative sales. The company launched advanced TCB systems including the Flexlex dual-head configuration and is developing panel-based platforms for future applications. TCB revenue reached $70 million in 2025 with expectations of exceeding $100 million in 2026. KLIC has also invested heavily in vertical wire packaging technology, launching the ATPremier MEM Plus system for memory applications. This technology promises 30% form factor reduction and targets the growing high-bandwidth memory (HBM) market, with first production systems expected in the first half of 2026. The company expanded its advanced packaging portfolio through new product introductions including sonotrode-enabled pin welding systems for power semiconductors and enhanced advanced dispense capabilities. Manufacturing capacity increased by 44% to 485,000 square feet to support anticipated demand growth. Strategic partnerships include joining a U.S. semiconductor consortium and collaborating with PDF Solutions for assembly analytics. The company has maintained strong capital allocation discipline through consecutive dividend increases and share repurchase programs, buying back 10.3 million shares over three fiscal years while investing in R&D for next-generation technologies.
KLIC company profile · for informational purposes only — not investment advice.
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