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601066.SH

中信建投

SSE · Financial Services · Financial - Capital Markets · CN

CNY 24.79
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  • Jul 21, 2026, 12:45 UTC

    The Asset Management Association of Shanghai and its member institutions pledged to support China's capital market through rational, value, and long-term investment.

  • Jul 20, 2026, 13:35 UTC

    Changyuan Group received an Administrative Penalty Decision from the China Securities Regulatory Commission.

  • Jul 20, 2026, 12:17 UTC

    Bosera Asset Management announced that several of its funds participated in the subscription for Changxin Technology's initial public offering of A-shares and received allocations.

  • Jul 17, 2026, 09:12 UTC

    China Securities Regulatory Commission approved the IPO registration of Jiangsu Gaokai Precision Fluid Technology Co., Ltd.

  • Jul 16, 2026, 09:15 UTC

    China Securities Regulatory Commission approved Kehua Holdings' application to issue A-shares to specific investors.

  • Jul 16, 2026, 09:13 UTC

    Zhongji Innolight executed a 586 million yuan block trade at 1113 yuan per share, with institutional buyers and multiple brokerage sellers.

  • Jul 14, 2026, 11:15 UTC

    Xynova completed a Series A equity financing round of hundreds of millions of yuan, led by Li Auto Strategic Investment, CSC Financial Capital, and CSC Financial Investment, with participation from Zhejiang Cultural Internet and Yuanjia Fund, and follow-on from existing investors.

  • Jul 14, 2026, 09:14 UTC

    Cinda Securities announced that its major asset restructuring application, involving CICC's share-for-share merger with Dongxing Securities and Cinda Securities, has been accepted by the China Securities Regulatory Commission.

  • Jul 10, 2026, 03:50 UTC

    Shanghai Pinzhun Laser Technology Co., Ltd. filed for an IPO on the STAR Market, planning to issue up to 10 million shares to raise about 1.41 billion yuan.

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  • Jul 6, 2026, 01:56 UTC

    Xi'an Unisem Semiconductor Co., Ltd. (Unisem) filed an IPO prospectus with the Beijing Stock Exchange, planning to raise 1.15 billion yuan for next-generation memory R&D and working capital.

  • Jul 3, 2026, 08:58 UTC

    Bohai Automotive announced an adjustment to its transaction plan for acquiring stakes in three companies, which does not constitute a major adjustment to the restructuring plan.

  • Jul 3, 2026, 05:51 UTC

    Shenzhen Hongxin Microelectronics Co., Ltd. (Hongxin Micro) filed an IPO application on the Hong Kong Stock Exchange on July 3, 2026, with China Securities (International) as the sole sponsor.

  • Jul 2, 2026, 01:06 UTC

    Hongqing Technology completed a Pre-B round financing of over 1.3 billion yuan, with cumulative financing exceeding 2.5 billion yuan.